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Kapcsolat
Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate |
Tartalom: | http://real.mtak.hu/64204/ |
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Archívum: | MTA Könyvtár |
Gyűjtemény: |
Status = In Press
Type = Article |
Cím: |
Effect of Nickel Addition on the Wettability and Reactivity
of Tin on Copper Substrate
|
Létrehozó: |
Somlyai-Sipos, László
Baumli, PĂ©ter
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Kiadó: |
Akadémiai Kiadó
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Dátum: |
2016-08-16
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Téma: |
TN Mining engineering. Metallurgy / bányászat, kohászat, fémipar
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Tartalmi leírás: |
The wettability of a copper substrate by Sn–Ni alloy and the interfacial active properties of nickel were investigated. We determined the contact angle as a function of holding time in the Sn–Ni/Cu system at low Ni concentration. The contact angle of Sn can be decreased from 30° to 25° by adding 0.1 wt% Ni to Sn. We observed accumulation of the nickel at the solid–liquid interface. We assume that the nickel accumulation is caused by the interfacial active property of the
nickel in an Sn–Ni/Cu system. |
Nyelv: |
magyar
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Típus: |
Article
PeerReviewed
info:eu-repo/semantics/article
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Formátum: |
text
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Azonosító: |
Somlyai-Sipos, László and Baumli, Péter (2016) Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate. RESOLUTION AND DISCOVERY. ISSN 2498-8707 (In Press)
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Kapcsolat: |
https://doi.org/10.1556/2051.2017.00039
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