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Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate

  • Metaadatok
Tartalom: http://real.mtak.hu/64204/
Archívum: MTA Könyvtár
Gyűjtemény: Status = In Press

Type = Article
Cím:
Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate
Létrehozó:
Somlyai-Sipos, László
Baumli, PĂ©ter
Kiadó:
Akadémiai Kiadó
Dátum:
2016-08-16
Téma:
TN Mining engineering. Metallurgy / bányászat, kohászat, fémipar
Tartalmi leírás:
The wettability of a copper substrate by Sn–Ni alloy and the interfacial active properties of nickel were investigated. We determined the contact angle as a function of holding time in the Sn–Ni/Cu system at low Ni concentration. The contact angle of Sn can be decreased from 30° to 25° by adding 0.1 wt% Ni to Sn. We observed accumulation of the nickel at the solid–liquid interface. We assume that the nickel accumulation is caused by the interfacial active property of the
nickel in an Sn–Ni/Cu system.
Nyelv:
magyar
Típus:
Article
PeerReviewed
info:eu-repo/semantics/article
Formátum:
text
Azonosító:
Somlyai-Sipos, László and Baumli, Péter (2016) Effect of Nickel Addition on the Wettability and Reactivity of Tin on Copper Substrate. RESOLUTION AND DISCOVERY. ISSN 2498-8707 (In Press)
Kapcsolat:
https://doi.org/10.1556/2051.2017.00039