Electrochemical migration of Sn and Sn solder alloys: a review
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Tartalom: http://real.mtak.hu/63112/
Archívum: MTA Könyvtár
Gyűjtemény: Status = Published

Type = Article
Cím:
Electrochemical migration of Sn and Sn solder alloys: a review
Létrehozó:
Zhong, Xiankang
Chen, Longjun
Medgyes, BĂĄlint
Zhang, Zhi
Gaod, Shujun
Jakab, LĂĄszlĂł
Kiadó:
Royal Society of Chemistry
Dátum:
2017
Téma:
TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Tartalmi leírás:
Sn and Sn solder alloys in microelectronics are the most
susceptible to suffer from electrochemical migration (ECM)
which significantly compromises the reliability of
electronics. This topic has attracted more and more attention
from researchers since the miniaturization of electronics and
the explosive increase in their usage have largely increased
the risk of ECM. This article first presents an introductory
overview of the ECM basic processes including electrolyte
layer formation, dissolution of metal, ion transport and
deposition of metal ions. Then, the article provides the
major development in the field of ECM of Sn and Sn solder
alloys in recent decades, including the recent advances and
discoveries, current debates and significant gaps. The
reactions at the anode and cathode, the mechanisms of
precipitates formation and dendrites growth are summarized.
The influencing factors including alloy elements (Pb, Ag, Cu,
Zn, etc.), contaminants (chlorides, sulfates, flux residues,
etc.) and electric field (bias voltage and spacing) on the
ECM of Sn and Sn alloys are highlighted. In addition, the
possible strategies such as alloy elements, inhibitor and
pulsed or AC voltage for the inhibition of the ECM of Sn and
Sn solder alloys have also been reviewed.
Nyelv:
angol
Típus:
Article
PeerReviewed
info:eu-repo/semantics/article
Formátum:
text
Azonosító:
Zhong, Xiankang and Chen, Longjun and Medgyes, BĂĄlint and Zhang, Zhi and Gaod, Shujun and Jakab, LĂĄszlĂł (2017) Electrochemical migration of Sn and Sn solder alloys: a review. RSC Advances, 7 (45). pp. 28186-28206. ISSN 2046-2069
Kapcsolat:
https://doi.org/10.1039/C7RA04368F
MTMT:3231975; doi:10.1039/C7RA04368F