| Tartalom: |
http://real.mtak.hu/63107/ |
| Archívum: |
MTA Könyvtár |
| Gyűjtemény: |
Status = Published
Type = Article
|
| Cím: |
Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl
|
| Létrehozó: |
Medgyes, BĂĄlint
|
| Kiadó: |
Springer
|
| Dátum: |
2017
|
| Téma: |
TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
|
| Tartalmi leírás: |
The electrochemical migration (ECM) mechanism occurs at the
presence of moisture in the case of operating circuits and
results in shorts (dendrites) between adjacent conductor
lines/traces. Dendrite growth occurs as a result of metal ions
being dissolved into a solution from the anode and deposited at
the cathode, thereby growing in tree-like formations. In this
study the water condensation process and ECM behavior of Nickel
(Ni), Electroless Nickel Immersion Gold (ENIG) and pure copper
were investigated using Thermal Humidity and Bias (THB) test in
NaCl environment. The THB results show that Cu has higher ECM
resistance than Ni and ENIG surface finishes, which was an
unexpected result. The main influencing factors of the water
condensation (e.g.: surface roughness, thermal parameters) and
the ECM processes (precipitates and dendrites) were investigated
and discussed in details. Furthermore, a novel ECM model for Ni
and NiAu surface finish was established using THB test in case
NaCl contaminated samples.
|
| Nyelv: |
angol
|
| Típus: |
Article
PeerReviewed
info:eu-repo/semantics/article
|
| Formátum: |
text
|
| Azonosító: |
Medgyes, BĂĄlint (2017) Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl. Journal of Materials Science: Materials in Electronics, 28. pp. 1-7. ISSN 0957-4522
|
| Kapcsolat: |
https://doi.org/10.1007/s10854-017-7806-5
MTMT:3262201; doi:10.1007/s10854-017-7806-5
|
