Characterization of the microstructure of tin-silver lead free solder
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Tartalom: http://real.mtak.hu/41373/
Archívum: MTA Könyvtár
Gyűjtemény: Status = Published



Type = Article
Cím:
Characterization of the microstructure of tin-silver lead free solder
Létrehozó:
Hurtony, Tamas
Szakál, Alex
Almásy, László
Len, Adél
Kugler, Sándor
Bonyar, Attila
Gordon, PĂ©ter
Kiadó:
Elsevier
Dátum:
2016-02-22
Téma:
T2 Technology (General) / műszaki tudományok általában
TJ Mechanical engineering and machinery / gépészmérnöki tudományok
TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Tartalmi leírás:
Reliability and lifetime are the two most relevant design considerations in the production
of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies
are integrated in which thousands of solder joints are mounting the
electronic components to the
printed circuit boards. There
exists no standardised and universal observation method
for
characterising the fine micro
structure of such solder joints.
Previously we have developed a new
method for the quantitative characteriz
ation of lead
-
free solder alloys and in
present study the
validity of the proposed method is demonstrated.
M
icrostructure of Sn
-
3.5Ag lead free solder alloy
was investigated by electrochemical impedance spectroscopy.
Solder samples were solidified with
dif
ferent cooling rates in order to induce differences in the microstructure.
M
icrostructure of the
ingots was revealed by selective electrochemical etching. Electrochemical impedance spectr
a (EIS)
were
measured before and after
the
selective etching process.
The complex impedance
spectra
contain
information about microstructure of the solder alloys.
Comparison and mode
l
ling
of two
EIS spectra allowed
obtaining
a
characteristic parameter of
surface structure of the etched
specimens.
The EIS measurements were c
omplemented with small angle neutron scattering
measurements
and scanning electron microscopy
, in order to correlate the EIS parameter with the
magnitude of the interface of the
β
-
Sn and Ag
3
Sn
phases.
Nyelv:
angol
Típus:
Article
PeerReviewed
info:eu-repo/semantics/article
Formátum:
text
Azonosító:
Hurtony, Tamas and Szakál, Alex and Almásy, László and Len, Adél and Kugler, Sándor and Bonyar, Attila and Gordon, Péter (2016) Characterization of the microstructure of tin-silver lead free solder. JOURNAL OF ALLOYS AND COMPOUNDS, 672. pp. 13-19. ISSN 0925-8388
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