Electrochemical migration of Cu and Sn in Na2SO4 environment
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Tartalom: http://real.mtak.hu/40440/
Archívum: MTA Könyvtár
Gyűjtemény: Status = Published


Type = Conference or Workshop Item
Cím:
Electrochemical migration of Cu and Sn in Na2SO4 environment
Létrehozó:
Medgyes, Balint
Szabo, Peter
Tamasi, Patrik
Gal, Laszlo
Harsanyi, Gabor
Dátum:
2016-09-08
Téma:
T2 Technology (General) / műszaki tudományok általában
TK Electrical engineering. Electronics Nuclear engineering / elektrotechnika, elektronika, atomtechnika
Tartalmi leírás:
The effect of Na2SO4 concentration on electrochemical migration (ECM) of copper and tin was investigated applying an in-situ optical and real-time electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values, the ECM susceptibility of copper has increased at low concentration levels. However, the ECM susceptibility of copper has decreased at the medium and stopped at the high and even saturated concentration levels. On the other hand, the ECM susceptibility of tin has increased at low levels. Afterwards the ECM ability of tin was hindered and even stopped at medium level. Interestingly, the ECM susceptibility of tin was reappeared at high concentration levels.
Nyelv:
magyar
magyar
Típus:
Conference or Workshop Item
NonPeerReviewed
info:eu-repo/semantics/conferenceObject
Formátum:
text
text
Azonosító:
Medgyes, Balint and Szabo, Peter and Tamasi, Patrik and Gal, Laszlo and Harsanyi, Gabor (2016) Electrochemical migration of Cu and Sn in Na2SO4 environment. In: 39th International Spring Seminar on Electronics Technology, 2016.05.18 - 2016.05.22, Plzen, Csehország, .
Kapcsolat:
doi:10.1109/ISSE.2016.7563195